are engineered interface materials that combine efficient thermal conductivity with excellent compressibility, making them ideal for enhancing heat dissipation and protecting electronic components.
High Thermal Conductivity: Effectively transfers heat from components such as chips, ICs, and power modules to heat sinks or metal enclosures.
Gap Filling Capability: Conforms to uneven surfaces, compresses under pressure to eliminate air gaps, and reduces thermal contact resistance.
Soft and Compressible: The elastic nature of the material helps absorb assembly stress and ensures consistent surface contact between interfaces.
Environmental Durability: Withstands a wide range of temperatures and meets flame retardancy requirements, making it suitable for long-term use in demanding electronic applications.
These are typical specifications. Actual values can be customized based on requirements. Please contact us for inquiries.
| Feature | 1.0 W/m.k | 1.2 W/m.k | 1.5 W/m.k | 2.0 W/m.k | 2.5 W/m.k | 3.0 W/m.k | 4.0 W/m.k | 5.0 W/m.k | 6.0 W/m.k | 7–8 W/m.k |
|---|---|---|---|---|---|---|---|---|---|---|
| PI Film Reinforced | TP150-RPI | TP300-PI | ||||||||
| High Tear Strength | TP120-R/RP | TP150-R/RP | TP200-R/RP | TP300-R | TP500-R | |||||
| Silicone-Free | TP200-SF | TP300-SF | ||||||||
| EMI Absorbing / EMI Shielding | TP150-AM | TP300-AM | ||||||||
| Ultra-Soft | TP150-S | TP200-S | TP250-S | TP300-S | TP500-S | |||||
| Fiberglass Reinforced | UTP100-H30 | TP120-FG | TP200-CM | TP300-SFG | TP400-FG | TP500-FG | TP600-FG | |||
| Low Volatility | TP200-L | TP300-L | TP400-L | TP500-L | ||||||
| Low Oil Bleeding | TP150-O | TP400-O | ||||||||
| Low Dielectric Constant | TP150-P | TP300-P | TP500-P | |||||||
| Low Dielectric Constant & Low Oil Bleeding | TP150-PO | TP200-PO |
| Code | Meaning | Product Features | Typical Applications |
|---|---|---|---|
| AM | EMI Absorber | Low magnetic flux | Networking & Communications |
| CM | Single-sided Fiberglass Reinforced (former UTP series) | High tear strength, puncture resistant | Between PCB and enclosure/thermal modules |
| FG | Fiberglass Reinforced | Minimum thickness 0.5mm, high tear strength, puncture resistant | Between PCB and mechanical/thermal modules |
| L | Low Volatile | D4-D10 < 50ppm | Security devices, medical electronics, automotive electronics, optical communication modules |
| M/LD | Low Density | Formulated with low-density fillers, standard density product | Automotive, military, aerospace |
| O | Low Oil Bleed | Silicone-oil sensitive environment | |
| P | Low Dielectric Constant | EMI resistant | High-frequency communications, ECU |
| PI | PI Film Reinforced | High tear strength, high insulation, puncture resistant | Mechanically fixed and high pressure-resistance applications |
| PO | Low Oil Bleed & Low Dielectric | Silicone-oil sensitive applications | |
| QB | Boron Nitride Filled | Ultra-soft, low stress, ultra-low thermal resistance | Networking & Communications |
| R | High Tear & Low Dielectric Thermal Pad | Good handling in ultra-thin molding, ultra-low compression (<10%), Shore A hardness | High mechanical strength applications |
| RP | High Tear & Low Dielectric Thermal Pad | Minimum thickness 0.3mm, ultra-low compression, high tear strength | High mechanical strength applications |
| RPI | Ultra-thin PI Film Reinforced | Minimum thickness 0.3mm, ultra-low compression, high tear strength | Mechanically fixed, high pressure-resistance applications |
| S | Ultra-Soft | Low stress, max compression up to 80%, excellent gap filling | CPU |
| SF | Silicone-Free | Silicone content=0, no silicone oil | Silicone-sensitive applications |
| Q | High compression, low rebound | ||
| BK, G, etc. | Color | ||
| AS | A=Adhesive, S=Soft | Self-adhesive, ultra-soft | |
| QA | Ultra-low stress, pre-formed thermal pad available on request |
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