Thermal Conductive Silicone Pad

TP

Product Introduction

Thermal Conductive Silicone Pad

 are engineered interface materials that combine efficient thermal conductivity with excellent compressibility, making them ideal for enhancing heat dissipation and protecting electronic components.

  • High Thermal Conductivity: Effectively transfers heat from components such as chips, ICs, and power modules to heat sinks or metal enclosures.

  • Gap Filling Capability: Conforms to uneven surfaces, compresses under pressure to eliminate air gaps, and reduces thermal contact resistance.

  • Soft and Compressible: The elastic nature of the material helps absorb assembly stress and ensures consistent surface contact between interfaces.

  • Environmental Durability: Withstands a wide range of temperatures and meets flame retardancy requirements, making it suitable for long-term use in demanding electronic applications.

Feature

  • Thermal Conductivity (W/m·K): 1 ~ 15
  • Thermal Impedance (°C-in²/W, 1mm, 20psi): 0.11 ~ 1.50
  • Thickness (mm): 0.4 ~ 6.5
  • Hardness (Shore OO): 20 ~ 65
  • Continuous Operating Temperature (°C): -40 ~ 150

These are typical specifications. Actual values can be customized based on requirements. Please contact us for inquiries.

Model Selection Guide

Feature 1.0 W/m.k 1.2 W/m.k 1.5 W/m.k 2.0 W/m.k 2.5 W/m.k 3.0 W/m.k 4.0 W/m.k 5.0 W/m.k 6.0 W/m.k 7–8 W/m.k
PI Film Reinforced     TP150-RPI     TP300-PI        
High Tear Strength   TP120-R/RP TP150-R/RP TP200-R/RP   TP300-R   TP500-R    
Silicone-Free       TP200-SF TP300-SF          
EMI Absorbing / EMI Shielding     TP150-AM     TP300-AM        
Ultra-Soft     TP150-S TP200-S TP250-S TP300-S   TP500-S    
Fiberglass Reinforced UTP100-H30 TP120-FG   TP200-CM   TP300-SFG TP400-FG TP500-FG TP600-FG  
Low Volatility       TP200-L   TP300-L TP400-L TP500-L    
Low Oil Bleeding     TP150-O       TP400-O      
Low Dielectric Constant     TP150-P     TP300-P   TP500-P    
Low Dielectric Constant & Low Oil Bleeding     TP150-PO TP200-PO            

Description of Special Product Codes

Code Meaning Product Features Typical Applications
AM EMI Absorber Low magnetic flux Networking & Communications
CM Single-sided Fiberglass Reinforced (former UTP series) High tear strength, puncture resistant Between PCB and enclosure/thermal modules
FG Fiberglass Reinforced Minimum thickness 0.5mm, high tear strength, puncture resistant Between PCB and mechanical/thermal modules
L Low Volatile D4-D10 < 50ppm Security devices, medical electronics, automotive electronics, optical communication modules
M/LD Low Density Formulated with low-density fillers, standard density product Automotive, military, aerospace
O Low Oil Bleed   Silicone-oil sensitive environment
P Low Dielectric Constant EMI resistant High-frequency communications, ECU
PI PI Film Reinforced High tear strength, high insulation, puncture resistant Mechanically fixed and high pressure-resistance applications
PO Low Oil Bleed & Low Dielectric   Silicone-oil sensitive applications
QB Boron Nitride Filled Ultra-soft, low stress, ultra-low thermal resistance Networking & Communications
R High Tear & Low Dielectric Thermal Pad Good handling in ultra-thin molding, ultra-low compression (<10%), Shore A hardness High mechanical strength applications
RP High Tear & Low Dielectric Thermal Pad Minimum thickness 0.3mm, ultra-low compression, high tear strength High mechanical strength applications
RPI Ultra-thin PI Film Reinforced Minimum thickness 0.3mm, ultra-low compression, high tear strength Mechanically fixed, high pressure-resistance applications
S Ultra-Soft Low stress, max compression up to 80%, excellent gap filling CPU
SF Silicone-Free Silicone content=0, no silicone oil Silicone-sensitive applications
Q   High compression, low rebound  
BK, G, etc. Color    
AS A=Adhesive, S=Soft Self-adhesive, ultra-soft  
QA   Ultra-low stress, pre-formed thermal pad available on request  

Features

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Specifications

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