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Thermal Interface Material

Introduction

Thermal Interface Materials (TIMs) are essential thermal management solutions in electronic devices, specifically designed to enhance heat transfer between heat sources (such as CPUs, GPUs, and power transistors) and heat sinks. These materials fill the microscopic gaps and surface irregularities between the two, reducing thermal resistance and ensuring rapid and efficient conduction of heat from heat-generating components to cooling devices, thereby maintaining device stability and extending service life. They are widely used in various fields, including servers, automobiles, LED lighting, communication equipment, and consumer electronics.

Product Name Thermal Conductivity (W/m·K) Thermal Impedance (°C-in²/W, 1mm, 20psi)
EMI-Absorbing Thermal Silicone Pad
TP-AM
 1.5 ~ 5 0.845 ~ 0.413 -40 ~ 150 UL94 V-0 ≧10¹² ~ 10¹⁴ / 12 ~ 20
Non-Silicone Thermal Interface Pad
TP-SF
 2~3 0.3~0.7 (1mm,20psi) -40 ~ 120 UL94 V-1 7.3 ~ 10.14
Thermal Conductive Silicone Pad
TP
 1~1.5 0.11~1.50 (1mm,20psi) -40 ~ 150 UL94 V-0 10¹⁰ ~ 10¹³
Photo Product Name Thermal Conductivity (W/m·K) Thermal Impedance (°C-in²/W, 1mm, 20psi) Tensile Strength (MPa) Dielectric Breakdown Voltage (kV) Density (g/cm³)
product Fiberglass-Reinforced Thermal Insulation Pad
TC
 1.6 ～ 8.0 < 0.22 ～ < 0.61 11~20 , ASTM D412 ≥ 3.6 ～ ≥ 6.0 1.52~2.8 , ASTM D792
product Synthetic boron nitride (BN) thermal film
DHP
 ≥ 50 W/m·K - - > 40 kV/mm 1.6 ± 0.1 g/cm³
product Thermal Insulation Materials
TCK
 >4.0 ~ >6.0 ≤0.28 ~ ≤0.35 9.5~34 >4.0 ~ >6.0 2.5
Photo Product Name Thermal Conductivity (W/m·K) Thermal Impedance (°C-in²/W, 1mm, 20psi) Viscosity (cps) Working Time (hrs) @25°C (adjustable) Density (g/cm³)
product Two-part Thermally Conductive Gel
TF
 1.2~12 0.19~0.3 200K ~ 3800K 1~2 2.1~3.4
Photo Product Name Thermal Conductivity (W/m·K) Thermal Impedance (°C-in²/W, 1mm, 20psi) Density (g/cm³) Dielectric Breakdown Voltage (kV) Long-Term Use Temperature (°C)
product Two-part Thermally Conductive Potting Compound
GF
 0.8 ～ 3.6 0.08~2.35 0.83~3.1 6~10 -60 ～ 200
Photo Product Name Thermal Conductivity (W/m·K) Long-Term Use Temperature (°C) Density (g/cm³) Extrudability (g/min) Penetration (GB/T 269)
product Heat-conductive thermal putty
TM
 2.0 ～ 14.5 -60 ～ 200 2.9 ～ 3.3 0.49~20 160~280
Photo Product Name Thermal Conductivity (W/m·K) Long-Term Use Temperature (°C) Penetration (GB/T 269) Dielectric Breakdown Voltage (kV) Volatile Content (%) (120°C, 24h)
product Thermal Conductive Materials
TG
 1.0 ～ 6.0 -40 ～ 150 230~330 0.3~5.0 0.5~1.0
Photo Product Name Phase Change Temperature (°C) Thermal Conductivity (W/m·K) Operating Temperature Range (°C) Thermal Impedance °C-cm²/W 50psi @0.3mm
product High-Performance Phase-Change Thermal Interface Material (PCM)
PCM
 50 ～ 60 2 ～ 8.5 -40~150 0.05 ～ 0.53