Low pressure molding Hot Melt Adhesive
Introduction
Low Pressure Molding (LMP) Material is an advanced Polyamide (PA) hot melt specifically engineered for electronic encapsulation. Utilizing ultra-low pressure processing, it delivers superior waterproofing, dielectric insulation, and mechanical protection.
Low Pressure Molding (LMP) is a high-efficiency encapsulation process where hot melt material is injected into a mold at extremely low pressures—ranging from 1.5 to 40 bar—resulting in rapid solidification. Formulated from high-performance Polyamide (PA) resins, this material provides exceptional sealing, electrical insulation, and thermal stability, along with robust resistance to impact, moisture, dust, and chemical exposure.
Compared to traditional high-pressure injection molding or epoxy and silicone potting, LMP materials offer low-stress processing that prevents damage to fragile components. Furthermore, they are eco-friendly, recyclable, and offer significant advantages in throughput and cost-efficiency. LPM technology is widely adopted for wire harness connectors, sensors, transformers, mobile battery packs, PCB/ECU encapsulation, and automotive electronics, providing the global electronics industry with reliable and high-performance packaging solutions.
| Product Name | Hardness | Operating Temp. | Viscosity(mPa·s) | |
|---|---|---|---|---|
|
8807 Low Pressure Molding Material
8807/8807A
|
90A | -40℃~105℃ | 4000(mPa·s)/210℃ | |
|
8832 Low Pressure Molding Material
8832/8832A
|
40D | -40℃~110℃ | 3300 mPa·s/200℃ | |
|
8835 Low Pressure Molding Material
8835/8835A
|
48D | -25℃~150℃ | 4500(mPa·s)/220℃ | |
|
8846 Low-Pressure Molding Hot Melt Adhesive
8846/8846A
|
94A | -40℃~130℃ | 5500(mPa·s)/210℃ | |
|
8863 Low Pressure Molding Material
8863/8863A
|
83A | -40℃~120℃ | 3000(mPa·s)/200℃ | |
|
8878 Low Pressure Molding Material
8878/8878A
|
92A | -40℃~140℃ | 4500(mPa·s)/210℃ |
Low Pressure Molding (LPM) – Electronics Encapsulation
Watch: Low Pressure Molding (LPM) in Action Witness the actual molding process and see how it is applied to the encapsulation of electronic components, such as sensors and waterproof connectors. This video provides a detailed look at how LPM technology achieves rapid curing, precision sealing, and IP67/IP68-rated waterproof protection.
Video Credit: Gootschi Co., Ltd. YouTube Channel
Core Characteristics of Low Pressure Molding (LPM) Materials
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Superior Sealing & Protection：Provides IP67/IP68-rated waterproof, dustproof, and moisture-resistant protection, effectively shielding components from environmental corrosion.
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Excellent Dielectric Properties：High dielectric strength ensures the safe operation of electronic components while preventing short circuits and current leakage.
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Thermal & Impact Resistance：Features a wide operating temperature range (-40°C to 150°C) with outstanding resistance to mechanical impact and chemical exposure.
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Low-Pressure Processing： Injection pressure ranges from only 1.5 to 40 bar, eliminating the risk of damage to fragile or precision electronic components.
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Rapid Curing Cycles：Achieving mold sets within seconds, significantly boosting production throughput while reducing footprint and overhead costs.
Technical Specifications: LPM Materials
| Specification Item | Technical Parameters |
|---|---|
| Material Type | Low-Pressure Polyamide (PA) Hot Melt |
| Injection Pressure | 1.5～40 bar |
| Cycle Time | Seconds to tens of seconds |
| Temperature Range | -40°C to 150°C |
| Ingress Protection | IP67/IP68 |
Low-Pressure Molding Material 技術優勢對比
|
Comparison Item |
Low-Pressure Molding (LPM) |
Traditional Potting / High-Pressure Injection |
|---|---|---|
|
Injection Pressure |
Low (1.5 – 40 bar) |
High Pressure |
|
Material Fluidity |
Low viscosity; high flowability |
High viscosity; poor flowability |
|
Component Protection |
Gentle on fragile components |
Risk of damaging precision parts |
|
Encapsulation Features |
Sealing, insulation, moisture/water/dust-proof, impact & chemical resistance |
Relatively limited protection |
|
Material Properties |
Polyamide (PA) Hot Melt; Eco-friendly & recyclable |
Epoxy/Silicone; Lower environmental compatibility |
|
Cycle Time |
Seconds (rapid turnaround) |
Minutes to hours |
|
Production Efficiency |
High throughput; Lower total cost of ownership (TCO) |
Low efficiency; Higher defect rates |
Why Choose Low-Pressure Molding (LMP) Materials?
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Ultimate Protection for Sensitive Components: The low-pressure injection process eliminates mechanical stress, preventing damage to fragile electronics and ensuring superior product reliability.
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Accelerated Production Cycles: With curing times reduced to mere seconds, LPM shaves minutes—or even hours—off traditional processing times, drastically increasing throughput.
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Lower Total Cost of Ownership (TCO): Fast, low-cost tooling development combined with high yields and manufacturing efficiency delivers the optimal cost-to-performance ratio.
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Eco-Friendly & Sustainable: Our LPM materials are formulated from Polyamide (PA), fully complying with global environmental standards such as RoHS and REACH.
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All-in-One Comprehensive Shielding: The monolithic encapsulation provides IP67/IP68-rated protection against water and dust, while offering high insulation, thermal stability, and chemical resistance.
Key Application Areas for LPM Materials
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Wire Harnesses & Connectors: Waterproof encapsulation for automotive wire harnesses, industrial connectors, and consumer electronics.
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Sensors & Switches: Precision sealing for microswitches, pressure sensors, and temperature sensors to ensure environmental integrity.
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Transformers & Power Supplies: Dielectric insulation and encapsulation for power supply units, transformer windings, and terminals.
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Automotive Electronics: Ruggedized protection for lighting controllers, EV charging interfaces, and on-board electronic modules (IP67/IP68-rated).
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PCB & ECU Encapsulation: Selective protection for printed circuit boards and full encapsulation for Automotive Engine Control Units (ECUs).
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Battery Pack Assembly: Protective and dielectric encapsulation for mobile phone lithium-ion battery packs.
Moisture Content & Storage Guidelines for LPM Materials
LPM materials are hygroscopic polyamide-based hot melts. Excessive moisture content can negatively impact molding quality and structural integrity. To ensure consistent production, please adhere to the following guidelines：
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Impact of Moisture: High moisture levels can lead to fluctuations in melt viscosity, resulting in internal voiding (bubbles) and surface defects on the finished product.
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Storage Environment: Store materials in a cool, dry location. Ensure bags remain hermetically sealed to prevent exposure to ambient humidity.
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Drying Protocol: Before processing, pre-drying is recommended based on the material's specific softening point to maintain optimal physical properties and aesthetic finish.
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Technical Inquiries: For detailed moisture control limits and specific drying parameters, please refer to our Comprehensive Guide to LPM Material Dehumidification.
Frequently Asked Questions (FAQ)
Q: What is the difference between Low Pressure Molding (LPM) and traditional high-pressure injection molding?
A: LPM utilizes extremely low injection pressures (1.5–40 bar), ensuring that sensitive electronic components remain undamaged. In contrast, traditional injection molding operates at high pressures (often >100 bar), which can cause mechanical stress, deformation, or fractures in fragile parts. Additionally, LPM offers faster cycle times and reduced material waste, delivering a total cost-to-performance ratio that far exceeds traditional methods.
Q: What is the waterproof rating of Low Pressure Molding?
A: LPM provides superior sealing performance, achieving IP67/IP68-rated protection. It offers excellent resistance to water, dust, moisture, and extreme temperatures, making it ideal for outdoor and harsh environment applications.
Q: Are LPM materials eco-friendly? Which international standards do they meet?
A: Yes. Our LPM materials are formulated from Polyamide (PA) hot melts and are fully compliant with global environmental regulations, including RoHS and REACH standards.
Q: Do LPM materials require specific storage conditions?
A: Yes. Since LPM materials are hygroscopic, excessive moisture can compromise molding quality. We recommend storing them in a hermetically sealed dry environment. To ensure consistent quality and production stability, materials should be pre-dried based on their softening point before use. (Click here for detailed Storage & Drying Instructions).
Q: Which industries commonly use LPM technology?
A: LPM is widely utilized across the automotive, consumer electronics, industrial, telecommunications, and medical device sectors. It is particularly well-suited for any electronic encapsulation requiring both high-level protection and manufacturing efficiency.