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Two-part Thermally Conductive Gel

TF

Product Introduction

Two-part Thermally Conductive Gel  

(GTF Series) is a 1:1 mix, silicone-based gap-filler gel that cures at room temperature or with optional heat (e.g., 80 °C). After cure it forms a soft, compliant, and thermally conductive elastomer, delivering low compression force, excellent gap-filling/wetting, and stable thermal performance. Designed for automated dispensing and high-volume production to improve throughput and reduce material waste. Multiple thermal-conductivity grades are available; custom formulations can be provided on request.

Feature

  • Thermal Conductivity (W/m·K)：1.2~12
  • Thermal Impedance (°C-in²/W, 1mm, 20psi)：0.19~0.3
  • Viscosity (cps)：200K~3800K
  • Working Time (hrs) @25°C (adjustable)：1~2
  • Density (g/cm³) ：2.1~3.4

These are typical specifications. Actual values can be customized based on requirements. Please contact us for inquiries.

Model Selection Guide

Feature 1.0 W/m.k 1.2 W/m.k 1.5 W/m.k 2.0 W/m.k 2.5 W/m.k 3.0 W/m.k 4.0 W/m.k 5.0 W/m.k 6.0 W/m.k 7–8 W/m.k
Silicone-free       TF200-SF TF300-SF          
Low density       TF200-M            
Low volatility       TF200-L            
Low dielectric constant     TF150-P              

Description of Special Product Codes

Code Meaning Product Features Typical Applications
AM EMI Absorber Low magnetic flux Networking & Communications
CM Single-sided Fiberglass Reinforced (former UTP series) High tear strength, puncture resistant Between PCB and enclosure/thermal modules
FG Fiberglass Reinforced Minimum thickness 0.5mm, high tear strength, puncture resistant Between PCB and mechanical/thermal modules
L Low Volatile D4-D10 < 50ppm Security devices, medical electronics, automotive electronics, optical communication modules
M/LD Low Density Formulated with low-density fillers, standard density product Automotive, military, aerospace
O Low Oil Bleed   Silicone-oil sensitive environment
P Low Dielectric Constant EMI resistant High-frequency communications, ECU
PI PI Film Reinforced High tear strength, high insulation, puncture resistant Mechanically fixed and high pressure-resistance applications
PO Low Oil Bleed & Low Dielectric   Silicone-oil sensitive applications
QB Boron Nitride Filled Ultra-soft, low stress, ultra-low thermal resistance Networking & Communications
R High Tear & Low Dielectric Thermal Pad Good handling in ultra-thin molding, ultra-low compression (<10%), Shore A hardness High mechanical strength applications
RP High Tear & Low Dielectric Thermal Pad Minimum thickness 0.3mm, ultra-low compression, high tear strength High mechanical strength applications
RPI Ultra-thin PI Film Reinforced Minimum thickness 0.3mm, ultra-low compression, high tear strength Mechanically fixed, high pressure-resistance applications
S Ultra-Soft Low stress, max compression up to 80%, excellent gap filling CPU
SF Silicone-Free Silicone content=0, no silicone oil Silicone-sensitive applications
Q   High compression, low rebound  
BK, G, etc. Color    
AS A=Adhesive, S=Soft Self-adhesive, ultra-soft  
QA   Ultra-low stress, pre-formed thermal pad available on request  

Features

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Specifications

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